Sr. Principal/Sr. Director SoC chip lead

• Own end-to-end technical leadership and execution of complex SoC programs from architecture through silicon production.
• Drive SoC planning, integration strategy, execution schedules, risk management, and tape-out readiness.
• Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging, and product engineering.
• Define chip-level architecture, integration requirements, performance targets, and power/area objectives.
• Drive technical decision-making and trade-off analysis across architecture, implementation, and product requirements.
• Oversee subsystem and IP integration, ensuring successful deployment of complex multi-domain SoCs.
• Partner with analog and SerDes teams to integrate high-speed interfaces and mixed-signal subsystems into the overall chip architecture.
• Lead design reviews, execution reviews, silicon readiness assessments, and post-silicon debug activities.
• Drive issue resolution across the development lifecycle and ensure successful first-pass silicon execution.
• Mentor senior engineers and provide technical leadership across multiple engineering organizations.

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or related discipline.
• 20+ years of semiconductor industry experience with substantial leadership responsibility.
• Proven experience as a Chip Lead, SoC Lead, Technical Program Lead, or equivalent role for large-scale ASIC/SoC products.
• Demonstrated success leading advanced-node SoCs, preferably at 3nm and/or 5nm technology nodes .
• Deep understanding of SoC architecture, integration methodologies, and full-chip development flows.
• Strong experience working across:
  • RTL Design, Design Verification, Physical Design, DFT, Static Timing Analysis, Low-Power Design Methodologies and Silicon Bring-up and Productization.
• Experience managing complex schedules, technical dependencies, and cross-functional execution across global teams.
• Strong communication, stakeholder management, and engineering leadership skills.

Preferred Qualifications: 

• Prior experience with:
  • High-performance switching silicon
  • Network-on-Chip (NoC) architectures
  • Data movement and interconnect fabrics
  • High-bandwidth memory-centric systems
  • Complex multi-die or chiplet-based architectures
• Hands-on experience integrating:
  • High-speed SerDes interfaces, Analog front-end (AFE) subsystems, Mixed-signal IPs and Advanced PHY technologies.
• Experience with high-bandwidth and low-latency interconnect technologies.
• Knowledge of packaging technologies and signal integrity considerations for high-speed systems.
• Experience in AI, HPC, networking, connectivity, data-center, or memory infrastructure products.
• Prior exposure to UALink, Ethernet switching, switch fabrics, or similar high-performance interconnect technologies is highly desirable.