Senior Engineer II - Physical Design
Location:- Bangalore
Experience:- 5+Years
Are you looking for a unique opportunity to be a part of something great?
Want to join a 17,000-member team that works on the technology that powers
the world around us? Looking for an atmosphere of trust, empowerment,
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all that and more at Microchip Technology Inc.
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and solutions with unlimited career potential. Microchip’s
nationally-recognized Leadership Passage Programs support career growth
where we proudly enroll over a thousand people annually. We take pride in
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Job Description:
Microchip’s DSPIC Business Unit is seeking a skilled and experienced
Physical Design Engineer to join our global DSPIC Physical Design team. In
this role, you will be instrumental in driving the successful execution of
microcontrollers and microcontroller-based SOC designs, delivering the next
generation of hierarchical, low power, mixed signal microcontroller
solutions.
Key Responsibilities:
-
Implement complex mixed signal, low power designs using state-of-the-art
FLASH process technologies.
-
Work independently and efficiently on assigned project responsibilities,
from new design exploration through delivery of GDS (netlist to GDSII
flow) and Metal-only ECO implementation.
-
Provide Physical Design support for test chip shuttles, including
development work associated with new concepts and flow.
-
Develop and enhance Physical Design flow and methodology, including
comprehensive documentation.
-
Conduct power integrity and reliability analysis, ensuring robust sign-off
for all designs.
Detailed Job function:
-
Conduct floorplan exploration and optimization for accurate die size
estimation.
-
Perform power domain and voltage area-based floor planning, including
power grid planning and implementation.
-
Execute placement and optimization with a focus on timing, area, and power
efficiency.
-
Manage clock tree synthesis, balancing, and debugging to ensure robust
clock distribution.
-
Drive post-route timing optimization and timing closure to meet design
specifications.
-
Perform timing and signal integrity analysis at both chip and block
levels.
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Ability to lead chip and block level physical implementation activities.
-
Develop and refine physical design flow and methodology for improved
efficiency and quality.
-
Conduct physical verification, including DRC (Design Rule Check) and LVS
(Layout Versus Schematic).
-
Ensure IR drop and electromigration (EM) signoff for reliable power
delivery.
-
Implement timing and metal-only ECOs (Engineering Change Orders) as
needed.
-
Interface with internal and external IP teams, as well as CAD vendors, to
resolve technical issues.
-
Collaborate closely with synthesis, DFT, and other cross-functional global
teams to achieve timely tapeout and ensure first-pass working silicon.
Requirements/Qualifications:
-
Bachelor of Engineering in Electrical / Electronic Engineering or Master
of Engineering in Electrical / Electronic Engineering or Equivalent
-
Minimum of 6 years of hands-on experience in Physical Design and related
technical areas, demonstrating a strong track record of successful project
execution.
-
Advanced knowledge of place and route methodologies, as well as low power
physical design flows and methodologies.
-
Proficiency with industry-standard physical implementation and analysis
tools such as Innovus or Fusion Compiler, Calibre, Redhawk, Starrcxt, or
equivalent EDA tools.
-
Strong scripting skills in TCL, PERL, and Shell, along with working
knowledge of hardware description languages such as Verilog and VHDL.
-
Excellent analytical and debugging abilities, with a proactive approach to
identifying and resolving technical challenges.
-
Independent, self-motivated, and capable of managing responsibilities.
-
Outstanding oral and written communication skills, with the ability to
clearly convey technical concepts and collaborate effectively within a
team.
-
Familiarity with advanced nodes is desirable.