Principal, IC Package Engineer

Responsibilities:

• Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
• Perform simple PCB breakout studies for ball map feasibility
• Identify key issues for proposed designs based on silicon floor plans and desired package sizes
• Work with signal integrity engineers to implement high speed signal routes and quiet power routes
• Work with reliability engineers and external vendors to ensure manufacturability of package designs
• Create package routing constraints based on signal integrity routing rules
• Interact with and oversee work of external and internal package designers
• Produce package routing reports and diagrams for review by external teams
• Create and track package design schedules
• Guide and assist external design teams on creation of input data for package design flow.

 

Requirements/Qualifications:

 

• Applicable Bachelor’s or Master’s Degree
• 10+ years of industry experience
• Expert in package design using Cadence APD
• Expert in authoring APD design rules
• Scripting in PERL or SKILL is an asset
• Familiarity with flip chip and wire bond package designs
• Familiarity with PCB design and BGA fanout issues
• Understanding of high speed and power routing rules/issues
• Capable of handling multiple tasks at once
• Customer oriented, with attention to detail