Principal, IC Package Engineer

Job Description:

 

The Mixed Signal Development Group is responsible for delivering high-speed analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications.  From PCIe to 128+Gb/s SERDES, we enable technology that allows Microchip’s products to interface to the outside world.

 

As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team manager, and be engaged in the package design and layout.

 

 

Responsibilities:

• Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
• Perform simple PCB breakout studies for ball map feasibility
• Identify key issues for proposed designs based on silicon floor plans and desired package sizes
• Work with signal integrity engineers to implement high speed signal routes and quiet power routes
• Work with reliability engineers and external vendors to ensure manufacturability of package designs
• Create package routing constraints based on signal integrity routing rules
• Interact with and oversee work of external and internal package designers
• Produce package routing reports and diagrams for review by external teams
• Create and track package design schedules
• Guide and assist external design teams on creation of input data for package design flow.

 

Requirements/Qualifications:

 

• Applicable Bachelor’s or Master’s Degree
• 9+ years of industry experience
• Expert in package design using Cadence APD
• Expert in authoring APD design rules
• Scripting in PERL or SKILL is an asset
• Familiarity with flip chip and wire bond package designs
• Familiarity with PCB design and BGA fanout issues
• Understanding of high speed and power routing rules/issues
• Capable of handling multiple tasks at once
• Customer oriented, with attention to detail